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16th International Test Synthesis Workshop
(ITSW 2009)
March 23-25, 2009

University of Texas at Austin
Austin, Texas, USA

http://www.tttc-itsw.org

CALL FOR PAPERS
Scope -- Submissions -- Key Dates -- Additional Information -- Committees

Scope

Since the inception of ITSW in Santa Barbara in 1994 chip geometries have shrunk from 500 to 45 nanometers with smaller geometries on the near horizon. Digital circuit speeds have moved from the 100-200 MHz range to 2-3 GHz and higher. This amazing shrinkage and speedup has been spurred by innovative algorithms, tools, and methodologies in all aspects of digital chip design and manufacturing. The widespread use of Test Synthesis coupled with powerful pre-silicon verification approaches is one factor that has enabled test to keep up with the increasing chip complexity.

This year ITSW moves to a new location at the University of Texas, Austin. This year’s workshop will look at all aspects of test synthesis such as system bringup, system debug tools and architectures, re-use of pre-silicon DFT structures for post-silicon testing, hand-off of test IP, defect modeling, system test coverage metrics, SiP testing, system-level diagnostic methods, emerging standards for embedded testing, No Trouble Found methods, dealing with variations and imperfections inherent in the manufacturing process etc. As always ITSW will consider papers in any area of Test Synthesis including, but not limited to:

  • Register Transfer Level DFT
  • High-Level/Behavioral Test Synthesis
  • System-on-a-Chip (SOC) DFT
  • Memory and Logic BIST
  • Test Synthesis for Debug and Diagnosis
  • DFT for  Mixed-Signal Circuits
  • Test Resource Partitioning
  • Functional Verification
  • DFT for Emerging Technologies
  • Power and Noise-Aware Test
  • DFT for At-Speed Test
  • High-speed I/O test
  • Reducing the Cost of Test
  • Design for Manufacturing and Yield
  • Board and System Test
  • SER / Reliability
  • Test Synthesis for Reconfigurable Logic

 

Submissions

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To present recent research results at the workshop, please submit an extended abstract, one to three pages long, in PDF format, to the Program Chair by January 7, 2009. Acceptance notifications will be sent out on February 9, 2009. Please include the names, affiliations, and full contact information of all authors. Also, indicate which author will be the speaker if the abstract is accepted for presentation. To support open discussion, no formal proceedings of the workshop will be published. As in previous years, ITSW will present a BEST Student Paper Award to encourage student participation in the workshop.

Key Dates

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Submission deadline: January 7, 2009
Notification of acceptance: February 9, 2009

Additional Information
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For general information, contact:
Jennifer Dworak, General Chair
Division of Engineering
Brown University, Providence, RI, USA
Phone: 401.863.1531, Fax: 401.863.9039
Email: GeneralChair@tttc-itsw.org

Submit extended abstracts via email to:
Abhijit Jas, Program Chair
Design and Technology Solutions
Intel Corporation, Austin, TX 78746
Phone: 512.732.3978, FAX: 512.732.3912
Email: ProgramChair@tttc-itsw.org


Committees
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General Chair
J. Dworak – Brown U.

Past Chair
N. Mukherjee – Mentor Graphics

Vice Chair
S. Chakravarty - LSI

Program Chair
A. Jas – Intel

Panels Chair
S. Khatri – Texas A&M U.

Embedded Tutorials Chair
V. Chickermane - Cadence

Publicity Chair
B. Foutz – Cadence

Finance Chair
S. Patil – Intel

Local Arrangements Chair
N. Touba – U. Texas, Austin

European Liaison
M. Zwolinski – U. Southampton

Asian Liaison
C. W. Wu – Nat. Tsing Hua U.

Program Committee
M. Abadir – FreeScale
R. Aitken – ARM
K. Balakrishnan – AMD
C. Barnhart – SiliconAid
K. Chakrabarty – Duke U.
K.-T.Cheng – UC Santa Barbara
A. Crouch – Asset-Intertech
R. Datta – TI
S. Davidson – Sun Micro.
C. Dixit – LSI
A. Guettaf – Broadcom
M. Hsiao – Virginia Tech.
K. Iwasaki – Tokyo Metro. U.
R. Kapur – Synopsys
M. Laisne – QualComm
K.-J. Lee – Nat. Cheng-Kung U.
A. Majumdar – Sun Micro.
S. Mitra - Stanford
K. Mohanram - Rice U.
M. Nourani –U. Texas, Dallas
A. Orailoglu – UC San Diego
B. Pouya – Freescale
J. Qian – Cisco
J. Rajski – Mentor Graphics
S. M. Reddy – U. Iowa
M. Tahoori – Northeastern U.
S. Tragoudas – S. Illinois U.
H. Walker – Texas A&M U.
Li-C. Wang – UC Santa Barbara

For more information, visit us on the web at: http://www.tttc-itsw.org

TheInternational Test Synthesis Workshop (ITSW 2009) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

PAST CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

TTTC 1ST VICE CHAIR
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

SECRETARY
Christian LANDRAULT
LIRMM - France
Tel. +33-4-674-18524
E-mail landrault@lirmm.fr

ITC GENERAL CHAIR
Doug J. YOUNG
SV Probe Inc.
- USA
Tel.
E-mail dyoung@svprobe.com

TEST WEEK COORDINATOR
Yervant ZORIAN
Virage Logic Corporation - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TUTORIALS AND EDUCATION
Dimitris GIZOPOULOS

University of Piraeus
- Greece
Tel. +30-210-414-2372
E-mail dgizop@unipi.gr

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Zebo PENG
Linköping University - Sweden
Tel. +46-13-282-067/-281-000
E-mail zpe@ida.liu.se

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Alfredo BENSO
Politecnico di Torino - Italy
Tel. +39-011-564-7080
E-mail alfredo.benso@polito.it

 

PRESIDENT OF BOARD
Yervant ZORIAN
Virage Logic Corporation- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

SENIOR PAST CHAIR
Paolo PRINETTO
Politecnico di Torino - Italy
Tel. +39-011-564-7007
E-mail Paolo.Prinetto@polito.it

TTTC 2ND VICE CHAIR
Chen-Huan CHIANG

Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

FINANCE
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

IEEE DESIGN & TEST EIC
K.T. (Tim) CHENG
University of California, Santa Barbara - USA
Tel. +1-805-893-72942
E-mail timcheng@ece.ucsb.edu

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
Tel.+39-011-564-7055
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
STARC - Japan
Tel. +
E-mail hatayama.kazumi@starc.or.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

NORTH AMERICA
William R. MANN
SW Test Workshop - USA
Tel. +1-949-645-3294
E-mail william.mann@ieee.org

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
Tel. +39-051-209-3038
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Virage Logic Corporation- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com


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